Modelling of a high-speed precision robot for microelectro- mechanical systems bonding process application
รหัสดีโอไอ
Creator Wael A. Salah
Title Modelling of a high-speed precision robot for microelectro- mechanical systems bonding process application
Contributor Anees A. Sneineh
Publisher Maejo University
Publication Year 2561
Journal Title Maejo International Journal of Science and Technology
Journal Vol. 12
Journal No. 1
Page no. 51
Keyword microelectromechanical systems, planar parallel manipulator, kinematics, singularity, motion control
Website title Maejo International Journal of Science and Technology
ISSN 1905-7873
Abstract This paper presents the modelling of a planar parallel manipulator with two degrees of freedom by performing analyses of workspace, velocity and precision. Given that microelectromechanical systems (MEMS) are essential in the integration of mechanical system applications, the automation of the robot to be used for MEMS bonding process applications is proposed. This type of manipulator is commonly used for assembling electronic devices and in MEMS bonding because of its advantages over the serial manipulator. Forward and inverse kinematics and trajectory generation are determined. Singularity and workspace analyses are performed and dynamic equations for the actuators are determined. A control system is constructed by using a motion control card and motor driver amplifier to meet the requirements of the MEMS industry. Experimental results prove that the robot works in real time with high speed and high acceleration and presents a good response to trajectory generation. The robot covers the workspace field and avoids singularity.
MaejoInternational Journal of ScienceandTechnology

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