<?xml version="1.0" encoding="UTF-8"?>
<xml><bibliography><APA>Warisara Rungsitikul และผู้แต่งคนอื่นๆ. (2018) Evaluation of environmental impacts for non-metallic part in waste printed circuit boards (PCBs) using combined material flow analysis (MFA) and life cycle assessment (LCA). Chulalongkorn University:ม.ป.ท.</APA><Chicago>Warisara Rungsitikul และผู้แต่งคนอื่นๆ. 2018. Evaluation of environmental impacts for non-metallic part in waste printed circuit boards (PCBs) using combined material flow analysis (MFA) and life cycle assessment (LCA). ม.ป.ท.:Chulalongkorn University;</Chicago><MLA>Warisara Rungsitikul และผู้แต่งคนอื่นๆ.  Evaluation of environmental impacts for non-metallic part in waste printed circuit boards (PCBs) using combined material flow analysis (MFA) and life cycle assessment (LCA).  ม.ป.ท.:Chulalongkorn University, 2018. Print.</MLA></bibliography></xml>
