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<xml><bibliography><APA>Assadej Vanichchinchai และ Wanwisa Duantrakoonsil. (2018) Quality improvement of printed circuit board: A case study of copper in hole. &lt;i&gt;Science, Engineering and Health Studies&lt;/i&gt;, &lt;i&gt;12&lt;/i&gt;(2), 77-84.</APA><Chicago>Assadej Vanichchinchai และ Wanwisa Duantrakoonsil. "Quality improvement of printed circuit board: A case study of copper in hole". Science, Engineering and Health Studies  12 (2018):77-84.</Chicago><MLA>Assadej Vanichchinchai และ Wanwisa Duantrakoonsil. Quality improvement of printed circuit board: A case study of copper in hole. Silpakorn University Research and Development Institute:ม.ป.ท. 2018.</MLA></bibliography></xml>
