Chu Yee Khor และ Mohd Zulkifly Abdullah. (2012) Modelling and analysis of the effect of stacking chips with TSVs in 3D IC package encapsulation process. <i>Maejo International Journal of Science and Technology</i>, <i>6</i>(2), 159.Chu Yee Khor และ Mohd Zulkifly Abdullah. "Modelling and analysis of the effect of stacking chips with TSVs in 3D IC package encapsulation process". Maejo International Journal of Science and Technology 6 (2012):159.Chu Yee Khor และ Mohd Zulkifly Abdullah. Modelling and analysis of the effect of stacking chips with TSVs in 3D IC package encapsulation process. Maejo University:ม.ป.ท. 2012.