Sakulkaew Srisang และ Somchai Puajindanetr. (2015) Reduction of adhesive stain defect in flexible printed circuit board on hot pressing process: A case study of electronic component factory. <i>KKU Engineering Journal</i>, <i>42</i>(1), 61-69.Sakulkaew Srisang และ Somchai Puajindanetr. "Reduction of adhesive stain defect in flexible printed circuit board on hot pressing process: A case study of electronic component factory". KKU Engineering Journal 42 (2015):61-69.Sakulkaew Srisang และ Somchai Puajindanetr. Reduction of adhesive stain defect in flexible printed circuit board on hot pressing process: A case study of electronic component factory. Faculty of Engineering, Khon Kaen University:ม.ป.ท. 2015.