Prajak JATTAKUL และ Tavee MADSA;Piyawan SUNASUAN;Niwat MOOKAM. (2021) Influence of cooling conditions on microstructure and mechanical property of Sn-0.3Ag-0.7Cu lead-free solder. <i>Journal of Metals, Materials and Minerals</i>, <i>31</i>(2), 129-136.Prajak JATTAKUL และ Tavee MADSA;Piyawan SUNASUAN;Niwat MOOKAM. "Influence of cooling conditions on microstructure and mechanical property of Sn-0.3Ag-0.7Cu lead-free solder". Journal of Metals, Materials and Minerals 31 (2021):129-136.Prajak JATTAKUL และ Tavee MADSA;Piyawan SUNASUAN;Niwat MOOKAM. Influence of cooling conditions on microstructure and mechanical property of Sn-0.3Ag-0.7Cu lead-free solder. Metallurgy and Materials Science Research Institute Chulalongkorn University:ม.ป.ท. 2021.